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The effects of cold plasma treatment on wheat seed germination and seedling growth under copper stress
Received:May 17, 2018  
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KeyWord:cold plasma treatment;copper stress;wheat;germination;growth
Author NameAffiliationE-mail
DENG Min Resource and Environmental Engineering College, Guizhou University, Guiyang 550025, China
Key Laboratory of Soil Environment and Pollution Remediation, Institute of Soil Science, Chinese Academy of Sciences, Nanjing 210008, China 
 
ZHAO Ling Key Laboratory of Soil Environment and Pollution Remediation, Institute of Soil Science, Chinese Academy of Sciences, Nanjing 210008, China  
TENG Ying Key Laboratory of Soil Environment and Pollution Remediation, Institute of Soil Science, Chinese Academy of Sciences, Nanjing 210008, China yteng@issas.ac.cn 
LIU Fang Resource and Environmental Engineering College, Guizhou University, Guiyang 550025, China lfang6435@163.com 
XU Yong-feng Key Laboratory of Soil Environment and Pollution Remediation, Institute of Soil Science, Chinese Academy of Sciences, Nanjing 210008, China
University of Chinese Acade my of Sciences, Beijing 100049, China 
 
REN Wen-jie Key Laboratory of Soil Environment and Pollution Remediation, Institute of Soil Science, Chinese Academy of Sciences, Nanjing 210008, China  
MENG Ke Key Laboratory of Soil Environment and Pollution Remediation, Institute of Soil Science, Chinese Academy of Sciences, Nanjing 210008, China
University of Chinese Acade my of Sciences, Beijing 100049, China 
 
MA Wen-ting Key Laboratory of Soil Environment and Pollution Remediation, Institute of Soil Science, Chinese Academy of Sciences, Nanjing 210008, China  
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Abstract:
      Several studies have reported that cold plasma treatment technology can not only enhance the resistance of crop seeds to salinity, drought, and cold, but can also improve the yield and quality of agricultural products. However, little information has been obtained on in creasing the heavy metal resistance of crops germinated from seeds treated with cold plasma technology. To assess the effect of cold plasma treatment on the heavy metal resistance of seeds germinated, the germination and seedling growth of three varieties of wheat were investigat ed at three copper stress levels and four cold plasma power treatments. Seed germination rate, root length, sprout length, and copper concen tration in the wheat seedlings were measured, and the germination and vigor indices, absorption coefficient, and transfer factors were calcu lated. The results showed that cold plasma treatments did not significantly affect the germination rates and indices under copper stress, but vigor index was improved markedly. The root length, sprout length, and vigor index increased by 46.2%, 145.4%, and 82.1%, respectively, under the optimal cold plasma power treatment compared to those with no cold plasma treatments. At low copper concentrations, the amount of copper absorbed by the roots and sprouts increased under the cold plasma power treatment. However, at the high copper concentrations, cold plasma treatments improved the transport capacity of copper from roots to sprouts, which could alleviate the toxic effects of copper stresses on seed germination and root growth. These results suggest that cold plasma could effectively alleviate the toxic effects of copper on wheat.